TahoeRF

Services
Tahoe RF Semiconductor develops customer-specific Analog & RFIC chipsets, designs and IP.

Our design service areas include System and Chip architecture, Front-end Circuit Design and Simulation, Back-end Layout, DRC/LVS, Post Layout Simulation, Fully Packaged Parts including Test Development, and Fabrication Support and Management.

The Tahoe RF Semiconductor team was previously the IBM wireless IC products group. Incorporated in 2002, Tahoe RF Semiconductor has built a solid reputation with a variety of large and startup clients. We service both national and international customers, headquartered in Auburn, California, a suburb of Sacramento.

Philosophy
One of Tahoe RF Semiconductor's greatest strengths is engaging our customers with creative, flexible and consistently effective design techniques. Tahoe RF Semiconductor provides outstanding RFIC technology solutions and professional services, total systems solutions with innovative techniques, using the latest industry developments and state-of-the-art technology.

Tahoe RF Semiconductor maintains a corporate commitment to recruit, train and maintain the best engineers and designers in the IC industry. We pride ourselves in superior performance at all levels, consistently achieving the highest standards. We also have a select network of superior quality subcontractors who perform as an integral part of our team. Because our care for our employees shows, we have enjoyed a 100% retention rate.

Project Management
Tahoe RF Semiconductor's management philosophy starts with a front-end analysis of customer need to determine the higher level requirements of each specific project. This phase is managed by a senior member of our team. Typically, this results in formalized chip level specifications that are mutually agreeable for both the customer and Tahoe RF Semiconductor. The next phase, the detailed design and implementation of the project, is executed using a formal and proven design methodology flow. This methodology includes periodic formal design reviews, milestones and formal documentations. All of these have contributed to first pass silicon successes of many of our recent projects.

Irshad Rasheed, President and CEO

Previously IBM Senior Manager Analog/Mixed Signal SiGe. Over 17 years in the industry in diverse roles and diverse end markets. Irshad has worked in startups and large multi-national companies developing ICs for communication and PC markets. He has held individual development roles and senior management positions during his career. His recent experience was in IBM leading a design group to develop integrated chipsets for GSM and WCDMA cellular markets using CMOS and SiGe technologies. Previous companies also include Commquest Technologies and Cirrus Logic.

Christopher Saint, Vice President of Engineering

Previously IBM Senior Manager/Design Center Manager.
Over 24 years in the industry. With experience ranging from GaAs processing, foundry support, RF/Microwave circuit design, CAD tool support and management, Chris has a very extensive skill set to choose from. His most recent position was managing the IBM Wireless Products Division Design Center in Auburn, California. The Design Center was part of the team responsible for developing integrated chipsets for GSM and WCDMA cellular markets using CMOS and SiGe technologies. Chris is also the author of two best selling technical books, IC Layout Basics: A Practical Guide and IC Mask Design: Essential Techniques. Previous companies also include Commquest Technologies, Analog Devices, Mosaic Microsystems, LSI Logic and Plessey Research Caswell.

Design and Physical
Extensive Analog and RFIC design experience
Radio Transceivers, PLL, Mixed Signal SOC ICs
Multiple technology experience
SiGe, CMOS, BiCMOS
Many first silicon spec-compliant parts
Entire WCDMA chipset, Analog Basebands
LNAs, Mixers, VCOs

IBM Foundry
Jazz Semiconductor
Atmel
Fujitsu
Peregrine Semiconductor
Mosis
GDA Technology
UC Davis
UC San Diego