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Design Services & Consulting

Tahoe RF Semiconductor develops customer-specific Analog & RFIC chipsets, designs and IP.

The company Senior IC Design Team has an impressive background of combined industry leadership, with an average of 15 years of industry experience. The team has demonstrated many first pass successes on complex full RF transceiver designs - from concept, system specification to high value production. A proven and rigorous design methodology has been developed to help assure our high rate of success. The team has experience working across multiple time zones and geographically diverse areas. Recent successes are in the following areas:

  • Wi-Fi (b, b/g combo)
  • CDMA/CDMA2000
  • WCDMA
  • TV Tuners & Receivers
  • ATE Pin Electronics
  • Satellite Communication
  • Our design service areas include:

  • System and Chip archetecture
  • Front-end Circuit Design and Simulation
  • Back-end layout, DRC/LVS, post layout simulation
  • Fully packaged parts including Test Development
  • Fabrication Support and Management

Technology Experience

Tahoe RF is experienced in designing ICs in multiple foundries from 0.5 microns to 90nm technologies. Tahoe RF has strong relationships with many of the mainstream leading foundries.

Tahoe RF Semiconductor design services are Ready for IBM Technology.

In addition, Tahoe RF has developed IC products in Jazz Semiconductor, Atmel, Fujitsu, Peregrine and other technologies.
Ready for IBM

Peregrine

Atmel

Jazz

Fujitsu

Design Experience

  • WCDMA Analog Baseband, Gain Stages, Filters
  • WCDMA direct convert receiver
  • CDMA2000 IF downconvert/ADC
  • 3 GHz VCOs
  • >4 GHz Quadrature generation
  • WCDMA Dual PLL/Syn
  • 900/1800 MHz LNAs
  • J-CDMA Transmit/Receive Chips
  • 8 GHz divide by 4
  • Dual modulus dividers

Design Methodology

Tahoe RF Semi has developed a rigorous design methodology that has proven valuable in consistently delivering first time silicon successes. It includes several decision checkpoints (DCPs). These checkpoints are designed to ensure that a project doesn't proceed to next phase without appropriate due diligence through design reviews. The main DCPs and the design reviews are:

DCP1 - Opportunity Assessment Review (OAR)
Is the project worth pursuing?

DCP2 - Concept Review (CR)
Is the design technically feasible?

DCP3 - System Review (SR), Interim Design Review (IDR)
Can the design proceed to the main design phase?

DCP4 - Critical Design Review (CDR), Test Readiness Review (TRR), Interim Layout Review (ILR)
Is the design in compliance with its objectives?

DCP5 - Final Design Review (FDR)
Is everything ready for tapeout/release?

DCP6 - Tapeout Review (TR)  & Design Verification Review (DVR) 
Is the data complete and ready for final release?

Example of First Pass Silicon Success
WCDMA Receive (Rex)

Tools

Tahoe RF Semiconductor is pleased to utilize a full complement of CADENCE software including: Spectre, Spectre RF, Composer, Virtuoso XL, Virtuoso Custom Router, Virtuoso Custom Placer, Verilog NC, AMS Designer, and DIVA/Assura.

 

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